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foundry:umc [2014/07/16 20:47] azonenberg [General characteristics] |
foundry:umc [2015/01/04 22:50] (current) |
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Power ring and pad layouts can vary somewhat, as does presence or absence of CMP filler between bond pads. | Power ring and pad layouts can vary somewhat, as does presence or absence of CMP filler between bond pads. | ||
- | On-die Flash option available. | + | On-die Flash/ |
==== Identification ==== | ==== Identification ==== | ||
- | The CMP filler pattern is distinctive and can be used as positive ID. | + | The CMP filler pattern is distinctive and can be used as positive ID. Fill polygons are rectangles with 2:1 aspect ratio, long side oriented parallel to the prevailing routing direction. |
CMP fill pattern table (measured from XC2C32A) | CMP fill pattern table (measured from XC2C32A) |