Differences

This shows you the differences between two versions of the page.

--- foundry:start [2013/12/27 23:36] – azonenberg
+++ foundry:start [2025/08/04 21:24] (current) – external edit 127.0.0.1
@@ Line 1: / Line 1: @@
 A foundry is an IC fabrication facility.
+This page lists all known foundries regardless of whether they are internal-only or offer their services to the public.
 ====== List of foundries ======
 {{topic>foundry}}
-====== Sarnoff Corporation ======
-Princeton, NJ
-====== Semiconductor Manufacturing International Corporation (SMIC) ======
-.35 um to 90nm
-====== Taiwan Semiconductor Manufacturing Company Limited (TSMC) ======
-Produces ICs for many third parties include such large organizations as nVidia.
-TODO: image some nVidia chips to see if we can capture some identifying marks.
-Processes
-  * CLN40/CMN40 @ 40 nm
-  * CLN45/CMN45 @ 45 nm
-  * CLN65/CMN65 @ 65 nm
-  * CLN90/CMN90 @ 90 nm
-  * CL013/CM013 @ 0.13 µm
-  * CL013LP @ 0.13 µm
-  * CL013LV @ 0.13 µm
-  * CL018/CM018 @ 0.18 µm
-  * CL018HV @ 0.18 µm
-  * CL018LP @ 0.18 µm
-  * CL018LV @ 0.18 µm
-  * CL025/CM025 @ 0.25 µm
-  * CL035/CM035 @ 0.35 µm
-  * CL035HV_BCD @ 0.35 µm
-  * CL035HV_DDD @ 0.35 µm
-  * "65 nm, 90 nm, 0.13um, 0.15 / 0.18 µm, 0.22 / 0.25µm, 0.30 / 0.35µm, 0.5 µm"
-{{topic>foundry_tsmc}}
-====== Texas Instruments (TI) ======
-Processes
-  * 32 nm
-  * 45 nm
-  * 90 nm
-  * 130 nm
-  * 200 mm wafers
-====== TowerJazz ======
-Israel: 6” and 8”
-US: 8”
-China "manufacturing partnerships"
-"silicon germanium (SiGe) bipolar complementary metal-oxide semiconductor (BiCMOS), silicon BiCMOS, digital CMOS, analog CMOS and RF CMOS technologies"
-====== TriQuint Semiconductor ======
-TriQuint Semiconductor Texas (Richardson, TX)
-====== United Microelectronic Corporation (UMC) ======
-Processes
-  * 28 nm
-  * 40 nm
-  * 65 nm
-  * 90 nm
-  * 0.13 um
-  * 0.15 um
-  * 0.18 um
-  * 0.25 um
-  * 0.35 um
-  * 0.5 um
-  * 0.6 um
-  * 8" wafers
-{{topic>foundry_umc}}
-====== Vanguard International Semiconductor Corporation (VIS) ======
-.18um to 0.5um
-" wafers
-====== X-FAB Semiconductor Foundries ======
-"CMOS; 1.0 - 0.18 µm modular mixed-signal CMOS technologies. BiCMOS; 0.6 µm technology. SOI-CMOS; 0.6 µm & 1.0 µm CMOS and BCD technology on SOI substrates. MEMS Technologies. CUSP"
 ====== References ======
+  - http://smithsonianchips.si.edu/ice/cd/PROF98/JAPAN.PDF
   - http://www.mosis.com/products/fab/schedule/
   - http://www.jazzsemi.com/fact-sheets.html
@@ Line 108: / Line 28: @@
   - http://www.hjtc.com.cn/aboutHJ/PressRelease.asp
   - http://www.hhnec.com/EN/Technology/index.aspx
-  - http://www.ssmc.com.sg/technology_portfolio.asp
   - http://www.ti.com/research/docs/TI_ManufacturingStrategy_WP.pdf
-  - http://www.magnachip.com/eng/product/foundry/proc_portfolio.jsp