azonenberg:microchip:pic32mx340f512h
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| + | Microchip PIC32 microcontroller. Made on TSMC 180nm according to change notices, but measurements of channel length show closer to 250. | ||
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| + | * 32 KB of SRAM | ||
| + | * 512 KB of NOR flash | ||
| + | * MIPS M4K CPU | ||
| + | * ADC | ||
| + | * PLL | ||
| + | * Other miscellaneous stuff | ||
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| + | IBIS model: Package made by Amkor. | ||
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| + | [[http:// | ||
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| + | Can be made at one of several fabs. One of these is TSMC Fab 11, MSL 548, EMB FLASH 1K process. | ||
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| + | ====== Package ====== | ||
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| + | Markings: | ||
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| + | (Microchip logo) | ||
| + | PIC32MX340F | ||
| + | 512H-80I/MR | ||
| + | (e3) | ||
| + | 0850KGV | ||
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| + | ====== Die ====== | ||
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| + | Size is approximately 4280 x 4740 μm (20.29 mm< | ||
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| + | Looks to be a 4-metal 250 nm process. | ||
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| + | ===== M4 (top layer) ===== | ||
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| + | Overview | ||
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| + | Interesting region in the middle of the die. Not sure what it does but provides a nice view of standard cells on lower layers. | ||
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| + | Test points on the flash array. Probably tied to bit/word lines. Maybe used for measuring read/erase margins during characterization? | ||
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| + | Random wiring in the middle of the die with test points | ||
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| + | Mask rev markings | ||
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| + | Test patterns on bottom edge | ||
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| + | ===== Delayering (HF) ===== | ||
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| + | Power busing near flash with exposed vias. ~700 nm via pitch is consistent with the 220-250 nm process node. | ||
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| + | ===== M1 ===== | ||
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| + | Overview | ||
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| + | Top left corner of SRAM array | ||
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| + | Edge of flash array | ||
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| + | Random standard cell region. Note large number of dummy cells. This is most likely due to their use of a cost-optimized process with less metal layers than would be necessary to route the design with more densely packed cells. | ||
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| + | ===== Active ===== | ||
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| + | NOR flash | ||
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| + | 6T SRAM | ||
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| + | Random logic. 250 nm channel length. | ||
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