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azonenberg:microchip:pic32mx340f512h

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azonenberg:microchip:pic32mx340f512h [2025/08/04 21:24] (current) – external edit 127.0.0.1
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 +{{tag>collection_az vendor_microchip type_processor type_processor/microcontroller type_processor/microcontroller/pic type_processor/microcontroller/mips year_unknown foundry_tsmc tech_180nm}}
 +
 +Microchip PIC32 microcontroller. Made on TSMC 180nm according to change notices, but measurements of channel length show closer to 250.
 +
 +  * 32 KB of SRAM
 +  * 512 KB of NOR flash
 +  * MIPS M4K CPU
 +  * ADC
 +  * PLL
 +  * Other miscellaneous stuff
 +
 +IBIS model: Package made by Amkor.
 +
 +[[http://www.microchip.com/mymicrochip/NotificationDetails.aspx?pcn=CYER-29IERZ854&opennew=n|YPAA1 Rev B2 EMB Flash HE 1K Process Qualification Report]]
 +
 +Can be made at one of several fabs. One of these is TSMC Fab 11, MSL 548, EMB FLASH 1K process.
 +
 +====== Package ======
 +
 +{{:azonenberg:microchip:dscf5038_cropped.jpg?300|}}
 +
 +Markings:
 +
 +    (Microchip logo)
 +    PIC32MX340F
 +    512H-80I/MR
 +    (e3)
 +    0850KGV
 +    
 +====== Die ======
 +
 +Size is approximately 4280 x 4740 μm (20.29 mm<sup>2</sup>).
 +
 +Looks to be a 4-metal 250 nm process.
 +
 +===== M4 (top layer) =====
 +
 +Overview
 +
 +{{:azonenberg:microchip:pic32mx340f512h_m4_bf_neo5x-4k.jpg?1000|}}
 +
 +Interesting region in the middle of the die. Not sure what it does but provides a nice view of standard cells on lower layers.
 +
 +{{:azonenberg:microchip:pic32mx340f512h_01_bf_neo40x_annotated.jpg?600|}}
 +
 +Test points on the flash array. Probably tied to bit/word lines. Maybe used for measuring read/erase margins during characterization?
 +
 +{{:azonenberg:microchip:pic32mx340f512h_15_bf_neo40x_annotated.jpg?600|}}
 +
 +Random wiring in the middle of the die with test points
 +
 +{{:azonenberg:microchip:pic32mx340f512h_16_bf_neo40x_annotated.jpg?600|}}
 +
 +Mask rev markings
 +
 +{{:azonenberg:microchip:pic32mx340f512h_02_bf_neo20x_annotated.jpg?600|}}
 +
 +Test patterns on bottom edge
 +
 +{{:azonenberg:microchip:pic32mx340f512h_17_bf_neo40x_annotated.jpg?300|}} {{:azonenberg:microchip:pic32mx340f512h_18_bf_neo40x_annotated.jpg?300|}} {{:azonenberg:microchip:pic32mx340f512h_19_bf_neo40x_annotated.jpg?300|}} {{:azonenberg:microchip:pic32mx340f512h_20_bf_neo40x_annotated.jpg?300|}}
 +{{:azonenberg:microchip:pic32mx340f512h_21_bf_neo40x_annotated.jpg?300|}} {{:azonenberg:microchip:pic32mx340f512h_22_bf_neo40x_annotated.jpg?300|}}
 +
 +===== Delayering (HF) =====
 +
 +Power busing near flash with exposed vias. ~700 nm via pitch is consistent with the 220-250 nm  process node.
 +
 +{{:azonenberg:microchip:pic32mx340f512h_23_bf_neo40x_annotated.jpg?600|}}
 +
 +===== M1 =====
 +
 +Overview
 +
 +{{:azonenberg:microchip:pic32mx340f512h_m1_bf_neo5x_4k.jpg?1000|}}
 +
 +Top left corner of SRAM array
 +
 +{{:azonenberg:microchip:pic32mx340f512h_30_bf_neo40x_annotated.jpg?600|}}
 +
 +Edge of flash array
 +
 +{{:azonenberg:microchip:pic32mx340f512h_34_bf_neo40x_annotated.jpg?600|}}
 +
 +Random standard cell region. Note large number of dummy cells. This is most likely due to their use of a cost-optimized process with less metal layers than would be necessary to route the design with more densely packed cells.
 +
 +{{:azonenberg:microchip:pic32mx340f512h_36_bf_neo40x_annotated.jpg?600|}}
 +
 +===== Active =====
 +
 +NOR flash
 +
 +{{:azonenberg:microchip:pic32mx340f512h_01_se_9000x_15kv_15mm.jpg?600|}}
 +
 +{{:azonenberg:microchip:pic32mx340f512h_02_se_35kx_15kv_15mm.jpg?600|}}
 +
 +6T SRAM
 +
 +{{:azonenberg:microchip:pic32mx340f512h_04_se_4500x_15kv_15mm.jpg?600|}}
 +
 +{{:azonenberg:microchip:pic32mx340f512h_05_se_15kx_15kv_15mm.jpg?600|}}
 +
 +Random logic. 250 nm channel length.
 +
 +{{:azonenberg:microchip:pic32mx340f512h_06_se_5kx_5kv_15mm.jpg?600|}}
 +
 +{{:azonenberg:microchip:pic32mx340f512h_07_se_18kx_5kv_15mm.jpg?600|}}