azonenberg:ftdi:ft232rl
Differences
This shows you the differences between two versions of the page.
| Next revision | Previous revision | ||
| azonenberg:ftdi:ft232rl [2013/01/30 08:43] – created azonenberg | azonenberg:ftdi:ft232rl [2025/08/04 21:24] (current) – external edit 127.0.0.1 | ||
|---|---|---|---|
| Line 1: | Line 1: | ||
| - | {{tag> | + | {{tag> |
| FT232RL USB-serial converter packaged in 28-SSOP. Most likely the same die as the FT232RQ (QFN) however this has not been confirmed. | FT232RL USB-serial converter packaged in 28-SSOP. Most likely the same die as the FT232RQ (QFN) however this has not been confirmed. | ||
| Line 5: | Line 5: | ||
| The FT232R has on-board EEPROM for descriptors and a pre-programmed unique serial number, as opposed to most of FTDI's other devices which require external EEPROMs. | The FT232R has on-board EEPROM for descriptors and a pre-programmed unique serial number, as opposed to most of FTDI's other devices which require external EEPROMs. | ||
| - | We were curious as to whether the FT232R was just a USB MCU like the Microchip MCP2200, or a pure ASIC. The lack of obvious ROM areas suggest that it is indeed an ASIC. | + | We were curious as to whether the FT232R was just a USB MCU like the Microchip MCP2200, or a pure ASIC. The lack of obvious ROM areas suggest that it is indeed an ASIC. FIB cross section suggests technology node is around 600 nm with 3 metal layers. |
| - | Map: http://siliconpr0n.org/ | + | Map: http://siliconprawn.org/ |
| Before decap: | Before decap: | ||
| Line 23: | Line 23: | ||
| {{: | {{: | ||
| - | Memory banks. Probably | + | Memory banks. Probably |
| {{: | {{: | ||
| Line 29: | Line 29: | ||
| {{: | {{: | ||
| - | {{: | + | {{: |
| Logic cell area. | Logic cell area. | ||
| Line 39: | Line 39: | ||
| Bond pad. | Bond pad. | ||
| - | {{: | + | {{: |
| + | |||
| + | [[https:// | ||
| + | |||
| + | * [[https:// | ||
azonenberg/ftdi/ft232rl.1359535389.txt.gz · Last modified: 2013/01/30 08:43 by azonenberg
