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I tried decapping an MSP430 using both solvents and it didn't do a thing. I did some research on epoxy chemistry, looks like this probably only works against a very limited number of epoxies. Its nuclear how common these are.

DMSO

https://twitter.com/Zeptobars/status/1036864880857546753: “After 6 month testing my personal most promising solvent is DMSO. Will need to do more tests with heating and ultrasound to speed up the process.”

Dynaloy DYNASOLVE 711 (06/14/2004)

When I talked to a sales rep he said that most people use this over Dynaloy Decap these days for IC decapsulation. The main advantage is that it is supposed to be much nicer to aluminum (ie bond pads). It doesn't explicitly list IC decapsulation on the datasheet so I didn't consider ordering it.

06/14/2004 MSDS

Chemical CAS Weight %
2-PROPANOL, 1-METHOXY 107-98-2 40-60
2-PROPANOL, 1-PHENOXY 770-35-4 15-40
2-PYRROLIDINONE, 1-METHYL- 872-50-4 15-35
METHOL ALCOHOL 67-56-1 2.5-10
POTASSIUM HYDROXIDE 1310-58-3 1-5

The KOH surprises me a little…maybe something else counteracts its effects on aluminum.

Dynaloy Decap

Advantages:

  • Acid free decap (gentle on metals?)
  • Datasheet claims it flakes, not swells. If so this makes it superior to swell epoxy removers which can damage bond wires
  • Does not eat aluminum (or one should hope anyway since they say its fine to heat in an aluminum container…)

Disadvantages

  • Expensive compared to simple acids (Ellsworth sells it from about $184-131 / quart)
  • Must be used hot (150C)

IC package procedure [Dynaloy decap data sheet]:

  1. Pour into glass, stainless or aluminum beaker
  2. Heat to 150C. Do not heat further. Boils at 189C, flash point at 95C
  3. Use metal tongs to remove sample
  4. Wash sample with water, IPA, or MEK to remove Decap

Notes:

  • To reuse: filter it
  • Store above 70F as will crystalize below 60F. If so just re-heat
  • Tarnishes silver and tinned leads
  • Use rubber or polyethylene gloves

02/17/2009 MSDS

Comparing the datasheet I got in 2013 to the old datasheet I found online, it seems that they changed the product over time. This datasheet lists the following content:

Chemical CAS Weight %
METHANE, SULFINYLBIS- (1) 67-68-5 60-90
2-PROPANOL, 1-PHENOXY- 770-35-4 10-30

Evidently the first is DMSO…never heard that name before

04/01/1993 MSDS

Content [Dynaloy decap MSDS]:

Chemical CAS Weight %
AMYL ACETATE 628-63-7 1-3%
METHYL SULFOXIDE, DIMETHYL SULFOXIDE 67-68-5 80-90%
PROPYLENE GLYCOL PHENYL ETHER 770-35-4 7-20%

Resbond SSH13

This one might be only for non-molded epoxies (IE useless for IC work)

Chemical CAS Weight %
Dichloromethane (DCM) 75-09-2 75%
Formic acid 64-18-6 10%
Phenol 108-95-2 5%

1,3-Dioxolane

http://www.intermediates.basf.com/chemicals/web/en/content/products-and-industries/performance-materials/high-performance-solvents/dioxolane

“Many applications of dioxolane are due to its ability to rapidly dissolve polar polymers, such as polyesters, epoxies and urethanes.”

References

 
decap/solvent.1536078862.txt.gz · Last modified: 2018/09/04 16:34 by mcmaster
 
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