Differences

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--- decap:solvent [2018/09/04 16:34] – mcmaster
+++ decap:solvent [2018/11/04 21:18] (current) – mcmaster
@@ Line 6: / Line 6: @@
-====== Dynaloy DYNASOLVE 711 (06/14/2004) ======
+====== Dynaloy DYNASOLVE 711 ======
 {{:decap:solvnet:dynasolve_711.jpg?150|}}
-When I talked to a sales rep he said that most people use this over Dynaloy Decap these days for IC decapsulation.  The main advantage is that it is supposed to be much nicer to aluminum (ie bond pads).  It doesn't explicitly list IC decapsulation on the datasheet so I didn't consider ordering it.
+-06-14: When I talked to a sales rep he said that most people use this over Dynaloy Decap these days for IC decapsulation.  The main advantage is that it is supposed to be much nicer to aluminum (ie bond pads).  It doesn't explicitly list IC decapsulation on the datasheet so I didn't consider ordering it.
@@ Line 87: / Line 87: @@
 "Many applications of dioxolane are due to its ability to rapidly dissolve polar polymers, such as polyesters, epoxies and urethanes."
+====== Pyridine and DMSO ======
+[[https://twitter.com/pvachonnyc/status/1059130879052791808|Twitter]]: "Pyridine and DMSO, maybe 3:1 concentration, heated? [[https://patentimages.storage.googleapis.com/ee/f3/40/6fac51d4ddf2f0/US4729797.pdf|This IBM patent]] suggested it"