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decap:purple_ceramic [2012/12/10 17:28]
azonenberg [EDS]
decap:purple_ceramic [2013/10/20 10:59] (current)
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 The sample was a 40-pin CDIP with gold plating that had been used by someone at the RPI cleanroom to practice wire bonding on. The die attach area and leadframe were covered with poorly adhered bonds. The sample was a 40-pin CDIP with gold plating that had been used by someone at the RPI cleanroom to practice wire bonding on. The die attach area and leadframe were covered with poorly adhered bonds.
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 The sample was placed on top of a standard pin stub mount with double-sided carbon tape and then tape was run along both rows of pins, over the top of the chip, and to the sample holder. It was hoped that this would avoid charging without the need to coat the sample. The sample was placed on top of a standard pin stub mount with double-sided carbon tape and then tape was run along both rows of pins, over the top of the chip, and to the sample holder. It was hoped that this would avoid charging without the need to coat the sample.
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 The sample was inserted into the chamber of the SEM (JEOL JSM-840 using tungsten filament) and almost immediately began to charge severely. Since the evaporator was down for repairs at the time, carbon coating was impossible so the sample was removed from the chamber and sputtered with the standard thickness of Pt (several angstroms). It was considered unlikely that the coating would be of sufficient thickness to interfere with analysis. Once coated, no charging was observed. The sample was inserted into the chamber of the SEM (JEOL JSM-840 using tungsten filament) and almost immediately began to charge severely. Since the evaporator was down for repairs at the time, carbon coating was impossible so the sample was removed from the chamber and sputtered with the standard thickness of Pt (several angstroms). It was considered unlikely that the coating would be of sufficient thickness to interfere with analysis. Once coated, no charging was observed.
 
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