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decap:hybrid [2012/02/20 04:34]
mcmaster created
decap:hybrid [2013/10/20 10:59] (current)
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   - Heat chip   - Heat chip
   - Using rotary tool (Dremel), sand down until bond wires are present.   - Using rotary tool (Dremel), sand down until bond wires are present.
-  ​-Should be able to be done in a few minutes +    ​- Should be able to be done in a few minutes 
-  -Sanding down until the die is visible is possible, but if will be followed with nitric bath anyway, is not worth the risk +    - Sanding down until the die is visible is possible, but if will be followed with nitric bath anyway, is not worth the risk 
-  -Squirting with fluid or using magnification may help to show the bond wire+    - Squirting with fluid or using magnification may help to show the bond wire
   - Pull up external leads towards the ground surface. This should deteriorate the top layer and leave the die on a small island in the middle   - Pull up external leads towards the ground surface. This should deteriorate the top layer and leave the die on a small island in the middle
-  ​-If package cracks during this, should not be a problem+    ​- If package cracks during this, should not be a problem
   - Combination of glue on carrier island to die being soft from heat and missing epoxy around die should allow die to separate from package with minimal epoxy attached   - Combination of glue on carrier island to die being soft from heat and missing epoxy around die should allow die to separate from package with minimal epoxy attached
   - Turn off heat   - Turn off heat
 
decap/hybrid.txt · Last modified: 2013/10/20 10:59 (external edit)
 
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