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decap:hybrid [2012/02/20 09:34] – created mcmaster | decap:hybrid [2012/02/20 09:35] – mcmaster | ||
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- Heat chip | - Heat chip | ||
- Using rotary tool (Dremel), sand down until bond wires are present. | - Using rotary tool (Dremel), sand down until bond wires are present. | ||
- | | + | |
- | -# Sanding down until the die is visible is possible, but if will be followed with nitric bath anyway, is not worth the risk | + | - Sanding down until the die is visible is possible, but if will be followed with nitric bath anyway, is not worth the risk |
- | -# Squirting with fluid or using magnification may help to show the bond wire | + | - Squirting with fluid or using magnification may help to show the bond wire |
- Pull up external leads towards the ground surface. This should deteriorate the top layer and leave the die on a small island in the middle | - Pull up external leads towards the ground surface. This should deteriorate the top layer and leave the die on a small island in the middle | ||
- | | + | |
- Combination of glue on carrier island to die being soft from heat and missing epoxy around die should allow die to separate from package with minimal epoxy attached | - Combination of glue on carrier island to die being soft from heat and missing epoxy around die should allow die to separate from package with minimal epoxy attached | ||
- Turn off heat | - Turn off heat |