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| decap:epoxy [2018/02/28 06:49] – [Laser] mcmaster | decap:epoxy [2019/05/13 21:00] – [Light Ray] mcmaster | ||
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| * They do the whole chip but avoid die area | * They do the whole chip but avoid die area | ||
| * Light Ray - IC Decapsulation | * Light Ray - IC Decapsulation | ||
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| + | ===== mcmaster ezlaze ===== | ||
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| + | TODO: add pictures, estimate material removal rate | ||
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| + | Basically this was too slow to be practical except for very small samples. That said, it did work very well. A quicklase or other higher throughput Nd:YAG system would likely work well | ||
| ====== Sandblast ====== | ====== Sandblast ====== | ||
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| - | ====== A. Zonenberg etch rate measurement ====== | ||
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| - | FIXME: move this somewhere better | ||
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| - | Copper etch - 70 ml 3% H2O2 + 10 ml conc. HCl. Heat to 70C, agitate with magnetic stirrer. | ||
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| - | Test sample was Altera Stratix IV. Silver or tin plated copper. Plating was gone after <1 min in etchant, metallurgy of the plating was not studied. 20 minutes of etching = 0.13mm removal so 6.5 um/min. This number is likely +/- 30% or so because the temperature of the solution slowly increased over the etch period. | ||
| ====== References ====== | ====== References ====== | ||