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carrier:epoxy [2013/05/05 07:14] mcmastercarrier:epoxy [2013/10/20 14:59] (current) – external edit 127.0.0.1
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 | DMC 2000HG | 175 | 26 | | DMC 2000HG | 175 | 26 |
  
-===== Additives =====+===== Composition =====
  
 Many thermoset epoxies contain bromine for flame retardation [Thermoplastics for Packaging 3]. Many thermoset epoxies contain bromine for flame retardation [Thermoplastics for Packaging 3].
 +
 +The following have been observed:
 +  * Epoxy resin
 +    * The specific contents are almost always omitted
 +    * Seen "Brominated epoxy resin"
 +  * Phenol resin
 +    * The specific contents are almost always omitted, sometimes see "Phenol novolac"
 +  * Fused silica
 +  * Antimony trioxide
 +  * Carbon black
 +  * Crystalline silica
 +  * Metal hydroxide
 +    * Specific contents always omitted
  
  
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 | Others | N/A | 1 | | Others | N/A | 1 |
  
-The epoxy is + 
 +===== Sumikon EME-6710SJ ===== 
 + 
 +^ Name ^ CAS ^ Mass % ^ 
 +| Silica fused | 60676-86-0 | 60-90 | 
 +| Epoxy, cresol novolac | 29690-82-2 | 5-15 | 
 +| Phenol novolac | 9003-35-4 | 3-10 | 
 +| Antimony trioxide | 1309-64-4 | 1-5 | 
 +| Brominated epoxy resin | 68541-56-0 | 1-3 | 
 +| Carbon black | 1333-86-4 | 0.1-0.5 | 
 + 
 +Epoxy is Poly[(o-cresyl glycidyl ether)-co-formaldehyde] 
  
 ====== Epoxy resin ====== ====== Epoxy resin ======
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   * Sumikon EME-6600CS: http://www.maximintegrated.com/emmi/pdfs/msds/MSDS_SUMITOMO_EME-6600CS_08-28-2002_R01-25-2008.pdf   * Sumikon EME-6600CS: http://www.maximintegrated.com/emmi/pdfs/msds/MSDS_SUMITOMO_EME-6600CS_08-28-2002_R01-25-2008.pdf
   * Hitachi CEL-9200: http://www.maximintegrated.com/emmi/pdfs/msds/MSDS_HITACHI_CEL9200-SERIES_02-19-1997_R10-31-2007.pdf   * Hitachi CEL-9200: http://www.maximintegrated.com/emmi/pdfs/msds/MSDS_HITACHI_CEL9200-SERIES_02-19-1997_R10-31-2007.pdf
 +  * Sumikon EME-6710SJ: http://www.maximintegrated.com/emmi/pdfs/msds/MSDS_SUMITOMO_EME6710SJ_09-03-2002_R09-28-2007.pdf
 +  * SUMITOMO EME-6710S: http://www.maximintegrated.com/emmi/pdfs/msds/MSDS_SUMITOMO_EME-6710S_08-08-2006_R02-19-2008.pdf
  
 Things to look into: Things to look into:
   * Characterization of Integrated Circuit Packaging Materials   * Characterization of Integrated Circuit Packaging Materials
 
carrier/epoxy.1367738097.txt.gz · Last modified: 2013/10/20 14:59 (external edit)
 
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