[[bonding:start]]
 
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bonding:start [2019/03/05 00:22] – created mcmasterbonding:start [2019/03/05 00:28] (current) – mcmaster
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 During reverse engineering activities, it is often necessary to [[bonding:removal|remove unwanted bonds]] and/or re-bond depackaged devices. During reverse engineering activities, it is often necessary to [[bonding:removal|remove unwanted bonds]] and/or re-bond depackaged devices.
  
-Equipment specific information has been moved to: https://microwiki.org/wiki/index.php/Bonder+Information on bonding technologies: 
 +  * [[bonding:flipchip]] 
 + 
 +For information on how to do bonding (equipment, techniques, etc) see: https://microwiki.org/wiki/index.php/Bonder
  
 
bonding/start.1551745349.txt.gz · Last modified: 2019/03/05 00:22 by mcmaster
 
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