Differences

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--- manufacture [2012/08/13 06:46] – mcmaster
+++ manufacture [2012/08/13 06:49] – [Wafer testing] mcmaster
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 Some circuits can undergo basic testing.by using test pads when still in the wafer. This eliminates the following steps only to find the entire wafer was bad. If too many units are bad during initial testing, the whole process is typically aborted.  Each bad IC is marked with a dot of black ink.  Above is from the same wafer as in the next section.
+FIXME: get a picture of a probe card
 ====== Dicing ======
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 {{:manufacture:blue_tak_side.jpg?300|}}
-Wafers are placed on a sticky mat, often blue, and then cut with diamond saws into individual dies.  The saws are precisely positioned to be just into the plastic layer.  The non-dotted (good) dies are then collected.  See first photo for an example (unknown device, probably a power diode).  Only the dotted (bad) dies remain.  The second photo shows the side of the wafer where the depressions between dies ends just where the wafer ends.
+Wafers are placed on a sticky mat, often blue, and then cut with diamond saws into individual dies.  The saws are precisely positioned to be just into the plastic layer.  The non-dotted (good) dies are then collected.  See first photo for an example (unknown device, probably a power diode).  Only the dotted (bad) dies remain.  The second photo shows the side of the wafer where the depressions between dies ends just where the wafer ends.  Also note the punch marks where good dies were ejected.
 {{:manufacture:diced_wafer.jpg?300|}}