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mcmaster:hp:hp-c5_1fi1-0001 [2014/12/27 08:25]
mcmaster
— (current)
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-{{tag>collection_mcmaster vendor_hp type_unknown year_unknown tech_unknown foundry_unknown}} 
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-====== System ====== 
- 
-From HP logic analyzer 
- 
-{{:mcmaster:hp:hp-c5_1fi1-0001:pcb.jpg?300|}} 
- 
- 
-====== Package ====== 
- 
-{{:mcmaster:hp:hp-c5_1fi1-0001:pack1.jpg?300|}} 
-{{:mcmaster:hp:hp-c5_1fi1-0001:pack2.jpg?300|}} 
- 
-Heatsink label: 
-<code> 
-HP-C5 1FI1-0001 
-USA 10/87 
-</code> 
- 
-The package itself looks like it might have an "E" stamped on it but otherwise no markings 
- 
- 
-====== Die ====== 
- 
-Somewhat unusual, the die does not have any overglass.  Instead, it had an (epoxy?) protective coat on it. 
- 
-The top metal is greenish.  My theory is that its related to copper traces left from removing the copper slug.  H2SO4 was used to do final decap. 
- 
-[[http://siliconpr0n.org/map/hp/hp-c5_1fi1-0001/top_metal_mit20x/|Top metal @ mit20x]] 
-  * [[http://siliconpr0n.org/map/hp/hp-c5_1fi1-0001/single/hp_hp-c5_1fi1-0001_top_metal_mit20x.jpg|Single]] (17587x18687, 113MB) 
  
 
mcmaster/hp/hp-c5_1fi1-0001.1419668725.txt.gz · Last modified: 2014/12/27 08:25 by mcmaster
 
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