Table of Contents

X-FAB Semiconductor Foundries

Fabs

Processes

  • “CMOS; 1.0 - 0.18 µm modular mixed-signal CMOS technologies. BiCMOS; 0.6 µm technology. SOI-CMOS; 0.6 µm & 1.0 µm CMOS and BCD technology on SOI substrates. MEMS Technologies. CUSP”

Devices

 
foundry/xfab.txt · Last modified: 2015/01/04 17:50 (external edit)
 
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