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The back attach was very difficult to get off. It was cooked in WFNA for 30 minutes in an attempt to release it. In retrospect, this was too long of a period and caused the WFNA to dilute, resulting in minor corrosion. It would have been better to do a 24 hour cold soak.

After cooking with no effect, I gave up and was going to try to gently remove it. After only very light handling, chunks started to come out of the back. I immediately stopped trying to remove it and instead went to lightly pick it up to deposit into a vial. The die then fractured from the tweezer pressure.

There appears to be a scratch pre-dating the other damage (given that its corroded). It is unclear where this came from.

The die is quite dirty since I was not able to safely ultrasonic clean it. Now that its been imaged, if there is desire for a cleaner image, I could try to clean it better but it may shatter.


Map @ Mit20x

digshadow/ami/781400.txt · Last modified: 2016/01/03 02:19 by mcmaster
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