Table of Contents

Package

144-pin TQFP supplied on cut tape. Die revision B.

Markings (top side):

XILINX(R)
SPARTAN(R)-6
XC6SLX4(TM)
TQG144BIV1209
D4371643A
2C

CAD floorplan

From PlanAhead.

Die

Samsung 45nm process.

Passivation was somewhat damaged due to overly aggressive cleaning.

Overview

Bond pads and test points

Die logo

Damaged passivation (from cleaning)

x1 metal layer (probably M5 and M6) in SEM:

Map

 
azonenberg/xilinx/xc6slx4.txt · Last modified: 2015/01/04 17:50 (external edit)
 
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