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azonenberg:ti:drv2605 [2013/12/23 06:47] azonenberg |
azonenberg:ti:drv2605 [2013/12/23 06:54] azonenberg |
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I2C controlled haptic motor driver packaged in a 3x3 ball 0.5mm WLCSP. | I2C controlled haptic motor driver packaged in a 3x3 ball 0.5mm WLCSP. | ||
- | This chip was removed from a PCB which had been damaged during assembly and would otherwise have been scrapped; there is a small amount of flux residue on the underside as a result. One corner of the die was slightly chipped during removal from the PCB. | + | This chip was removed from a PCB which had been damaged during assembly and would otherwise have been scrapped; there is a small amount of flux residue on the underside as a result. |
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+ | One corner of the die was slightly chipped during removal from the PCB. | ||
No decap was required; the top metal layer is visible through the polyimide overcoat simply by looking at the bottom side of the packaged device. | No decap was required; the top metal layer is visible through the polyimide overcoat simply by looking at the bottom side of the packaged device. | ||
Author' | Author' | ||
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+ | Top metal pitch looks like ~600nm. Maybe 180nm tech? | ||
====== Device overview ====== | ====== Device overview ====== |