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RAlink SoC found inside an AT&T femtocell.

Googling the part number on the die (RT3052) shows http://www.mediatek.com/_en/01_products/04_pro.php?sn=1045. The part is most likely a relabeled/fused RT3052:

Package

Die

Size is approximately 5600 x 5300 μm (29.7 mm2)

Map

TODO

 
azonenberg/ralink/rt2150f.txt · Last modified: 2015/01/04 17:50 (external edit)
 
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