Table of Contents

Package
Die
Map

collection mcmaster, vendor xilinx, year 2006, type logic, type logic/programmable, type logic/programmable/fpga, foundry ibm, foundry umc, tech 90nm

Family was dual-fabbed, not sure who made this die.

See also: xc3s50a

Package

Label:

XILINX (R)
SPARTAN (R)
XC3S50A TM
VQG100AGQ1045
D4177135A
4C

Die

Map

Bonded @ Mit5x

Top metal (M8) @ 20x