Table of Contents
Fabs
Processes
Devices
foundry
X-FAB Semiconductor Foundries
Fabs
Processes
“CMOS; 1.0 - 0.18 µm modular mixed-signal CMOS technologies. BiCMOS; 0.6 µm technology. SOI-CMOS; 0.6 µm & 1.0 µm CMOS and BCD technology on SOI substrates. MEMS Technologies. CUSP”
Devices