Source: https://web.archive.org/web/20210301211140/https://twitter.com/Siliconinsid/status/1366463072462909446
Text: IBM 65X6603 (1990)
Inside the metal can is a ceramic module with several surface mount capacitors and two flip chip silicon dies. Its functions are mysterious, just as IBM part numbers are.
#IBM #Hybrid
====== Package ======
====== Die ======
{{:bercovici:ibm:65x6603:die.jpg?300|}}