{{tag>collection_az vendor_xilinx vendor_atmel year_2006 type_logic type_logic/programmable type_logic/programmable/fpga type_memory type_memory/flash type_memory/flash/nor foundry_ibm foundry_umc tech_90nm tech_unknown}}

SRAM+Flash hybrid FPGA contains an XC3S50A die from Xilinx and an Atmel DataFlash die wire-bonded together.

The die ID code of the FPGA (X8701) matches the regular XC3S50A.

Full-die imagery of the FPGA was not acquired because the die is identical to the regular XC3S50A, which has already been imaged.

====== Package ======

{{:azonenberg:xilinx:dscf4617_cropped.jpg?300|}} {{:azonenberg:xilinx:dscf4752_cropped.jpg?300|}}

Label:

    (X) XILINX (R)
    SPARTAN (R)
    XC3S50AN (TM)
    TQG144AGQ1341
    D4631772A
    4C
    
Device was decapped in-package with 68% HNO3 on 1/29/2014 by lab group A of CSCI 4974/6974 at RPI. Note leadframe damage and bond wires with one end floating; the floating bond wires were easily bent by a short blast of compressed air.

{{:azonenberg:xilinx:xc3s50an_01_bf_sz.jpg?600|}}

{{:azonenberg:xilinx:xc3s50an_03_bf_sz.jpg?600|}}

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====== Flash die ======

{{:azonenberg:xilinx:xc3s50an_flash_05_bf_neo5x_annotated.jpg?600|}}

{{:azonenberg:xilinx:xc3s50an_flash_06_bf_neo10x_annotated.jpg?600|}}

{{:azonenberg:xilinx:xc3s50an_flash_07_bf_neo20x_annotated.jpg?600|}}

====== FPGA die ======

The FPGA die is covered by an overcoat which can be scratched off with a scalpel blade but does not respond to acid. Possibly some sort of polyimide?

{{:azonenberg:xilinx:xc3s50an_08_bf_neo20x_annotated.jpg?600|}}

{{:azonenberg:xilinx:xc3s50an_09_bf_neo20x_annotated.jpg?600|}}