{{tag>collection_az vendor_ti year_unknown type_processor type_processor/microprocessor type_processor/microprocessor/arm foundry_tsmc tech_65nm}}

====== Package ======

256-ball BGA, 1mm pitch.

{{:azonenberg:ti:s7303205_cropped.jpg?300|}}

====== Die ======

65 nm 6-metal process. Top layer looks like thick aluminum, lots of long-haul power distribution.

Size is approximately 5970 x 4370 μm (26.1 mm<sup>2</sup>).

{{:azonenberg:ti:am1707_bf_neo5x_3k.jpg?600|}}

Bottom left corner logo. Note "TI" logo upside-down relative to text.

{{:azonenberg:ti:am1707_25_bf_neo40x_annotated.jpg?300|}} {{:azonenberg:ti:am1707_26_bf_neo40x_annotated.jpg?300|}}

Nice view of M6 (horizontal thick aluminum), M5 (vertical power routing), M5 (mostly CMP filler here), and M4 (can't see much).

{{:azonenberg:ti:am1707_27_bf_neo40x_annotated.jpg?300|}}

Upper left corner alignment markings

{{:azonenberg:ti:am1707_28_bf_neo40x_annotated.jpg?300|}}

Damaged bond pad showing underlying layers

{{:azonenberg:ti:am1707_29_bf_neo40x_annotated.jpg?300|}}

Test pattern in scribe line

{{:azonenberg:ti:am1707_32_bf_neo40x_annotated.jpg?300|}}