{{tag>collection_az vendor_nvidia vendor_microsoft type_processor type_processor/gpu year_2000 tech_180nm foundry_tsmc}}

NVIDIA MCPX (labeled MCP1 on the die) southbridge from the original Xbox. Alleged to contain the secret boot ROM.

Made by a 150 nm 7-metal process by TSMC according to [[http://amo.net/NT/02-15-01XBOX.html]].

From preliminary die inspection, stack-up looks to be:
  * M7 = bond pads, horizontal power distribution, long-range horizontal interconnect
  * M6 = routing to bond pads, vertical power distribution, long-range vertical interconnect
  * M5 = medium-range vertical interconnect
  * M4 = medium-range horizontal interconnect
  * M3 = short-range vertical interconnect
  * M2 = short-range horizontal interconnect
  * M1 = intra-cell routing

====== Package ======

Markings:

    (logo)
    nVIDIA (R)
    MCPX X3
    F45819.1 0142B2
    A TAIWAN

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====== Die ======

Size is approximately 5300 x 5300 μm (28.1 mm<sup>2</sup>)

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Die logo

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Mask rev markings. Looks very similar to the [[mcmaster:nvidia:geforce_2_mx|GeForce 2 MX]] suggesting the two are made on the same, or nearly same, process. This is a little odd since the GeForce 2 was supposed to be 180 nm and sources list this chip as 150.

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Classic NVIDIA diagonal bond pads

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Possible boot ROM?

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Multi-focus stack down interconnect. Looks like 3 vertical, 3 horizontal layers plus M1 (not visible in this view).

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Closeup near bottom right showing cell sizes

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