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{{topic> | {{topic> | ||
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- | ====== Texas Instruments (TI) ====== | ||
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- | Processes | ||
- | * 32 nm | ||
- | * 45 nm | ||
- | * 90 nm | ||
- | * 130 nm | ||
- | * 200 mm wafers | ||
- | |||
- | ====== TowerJazz ====== | ||
- | |||
- | Israel: 6” and 8” | ||
- | |||
- | US: 8” | ||
- | |||
- | China " | ||
- | |||
- | " | ||
- | |||
- | ====== TriQuint Semiconductor ====== | ||
- | |||
- | TriQuint Semiconductor Texas (Richardson, | ||
- | |||
- | ====== United Microelectronic Corporation (UMC) ====== | ||
- | |||
- | Processes | ||
- | * 28 nm | ||
- | * 40 nm | ||
- | * 65 nm | ||
- | * 90 nm | ||
- | * 0.13 um | ||
- | * 0.15 um | ||
- | * 0.18 um | ||
- | * 0.25 um | ||
- | * 0.35 um | ||
- | * 0.5 um | ||
- | * 0.6 um | ||
- | * 8" wafers | ||
- | |||
- | {{topic> | ||
- | |||
- | ====== Vanguard International Semiconductor Corporation (VIS) ====== | ||
- | |||
- | 0.18um to 0.5um | ||
- | |||
- | 8" wafers | ||
- | |||
- | ====== X-FAB Semiconductor Foundries ====== | ||
- | |||
- | "CMOS; 1.0 - 0.18 µm modular mixed-signal CMOS technologies. BiCMOS; 0.6 µm technology. SOI-CMOS; 0.6 µm & 1.0 µm CMOS and BCD technology on SOI substrates. MEMS Technologies. CUSP" | ||
====== References ====== | ====== References ====== |