Differences

This shows you the differences between two versions of the page.

Link to this comparison view

Both sides previous revision Previous revision
Next revision Both sides next revision
foundry:start [2013/12/27 23:41]
azonenberg
foundry:start [2013/12/27 23:47]
azonenberg
Line 4: Line 4:
  
 {{topic>foundry}} {{topic>foundry}}
- 
-====== Texas Instruments (TI) ====== 
- 
-Processes 
-  * 32 nm 
-  * 45 nm 
-  * 90 nm 
-  * 130 nm 
-  * 200 mm wafers 
- 
-====== TowerJazz ====== 
- 
-Israel: 6” and 8” 
- 
-US: 8” 
- 
-China "manufacturing partnerships" 
- 
-"silicon germanium (SiGe) bipolar complementary metal-oxide semiconductor (BiCMOS), silicon BiCMOS, digital CMOS, analog CMOS and RF CMOS technologies" 
- 
-====== TriQuint Semiconductor ====== 
- 
-TriQuint Semiconductor Texas (Richardson, TX) 
- 
-====== United Microelectronic Corporation (UMC) ====== 
- 
-Processes 
-  * 28 nm 
-  * 40 nm 
-  * 65 nm 
-  * 90 nm 
-  * 0.13 um 
-  * 0.15 um 
-  * 0.18 um 
-  * 0.25 um 
-  * 0.35 um 
-  * 0.5 um 
-  * 0.6 um 
-  * 8" wafers 
- 
-{{topic>foundry_umc}} 
- 
-====== Vanguard International Semiconductor Corporation (VIS) ====== 
- 
-0.18um to 0.5um 
- 
-8" wafers 
- 
-====== X-FAB Semiconductor Foundries ====== 
- 
-"CMOS; 1.0 - 0.18 µm modular mixed-signal CMOS technologies. BiCMOS; 0.6 µm technology. SOI-CMOS; 0.6 µm & 1.0 µm CMOS and BCD technology on SOI substrates. MEMS Technologies. CUSP" 
  
 ====== References ====== ====== References ======
 
foundry/start.txt · Last modified: 2019/12/31 08:27 by mcmaster
 
Except where otherwise noted, content on this wiki is licensed under the following license: CC Attribution 4.0 International
Recent changes RSS feed Donate Powered by PHP Valid XHTML 1.0 Valid CSS Driven by DokuWiki